2017 new LY 5300 auto optical alignment system Mobile BGA rework station 3 zones 2500W

 

Our BGA Rework Station/ BGA reballing station are widely used to replace and repair the BGA chip in laptop, mobile phone, xbox360,ps3,etc.

The main user is repairing shops and factory to provide the after-sales service and rework.

 

How to separate BGA chip from motherboard? 

How to replace a new BGA chip?

 

Repair steps:

1)      Separate the BGA chip from mother board –we called desoldering

2)      Clean Pad

3)      Reballing  or replace a new BGA chip directly

4)      Alignment/Positioning – Depend on experience ,silk frame ,optical camera

5)      replace a new BGA chip - we called Soldering

 

1

Power supply

AC 220V±10% 50160Hz

2

Total power

Max 2500W

3

Heater power

Upper temp.zone 1200W,Down temp.zone 1200W

4

Electrical material

Driving motor + smart temp.controller + color touch screen

5

Temperature controlling

(high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1

6

Locating way

V shape slot,PCB support jigs can adjust

7

PCB size

Max 140.160mm Min 5.5 mm

8

Applicable chips

Max 80.80mm Min 1.1 mm

9

Overall dimension

L450.W470.H670mm

17

Temperature Interface

1 pcs

11

Weight of machine

40KG

12

Nozzel

4 top,1 bottom

13

Color

Blue+White Mini BGA rework station

LY SV550C BGA Rework Station

₹425,000.00Price